Basic Version UV Laser Marking Machine MUV-E-A
|Minimum line width (nm)||≤0.02|
|Minimum character (nm)||0.1|
|Supply voltage||220V 50HZ,10A|
|Overall dimension (mm)||650 X 1000 X 1500|
|Working environment||Temp : 15~35°C, humidity: 5~85%, Clean,less dust|
1.Equip with imported UV laser generator to guarantee high-quality laser beam, smaller laser spot, hyperfine marking, and high definition;
2.Extremely small heat-affected zone, almost no thermal effect on the material, which prevents materials from deformation, damage or burning;
3.Suitable for large range of material than infrared laser;
4.Imported high speed digital scanning galvanometer enjoys compact volume, high speed and superior stability;
5.The whole machine has stable performance and low power consumption;
6.The totally enclosed protection design can effectively prevent ultraviolet radiation which endangers human health;
7.The rotary worktable can be 2 or 4 stations, suitable for various products, High efficiency for loading & unloading and laser marking at the same time.
Suitable for fine marking of monocrystalline silicon wafer, IC grain, sapphire, plastics, leather, metal, glass, LCD screen, thin ceramic and the special material. It is popular for precise marking of electronics industry.